Analyses of Multiple Film Cracking in Film/Substrate Systems
Journal
Journal of the American Ceramic Society
Journal Volume
84
Journal Issue
3-12
Pages
2955-2961
Date Issued
2001
Author(s)
Abstract
Multiple film cracking in a film/substrate system is analyzed in the present study. The system is subjected to residual stresses before loading. A constant displacement rate is applied unidirectionally to stretch the system. An analytical model is developed to derive the stress distribution in the system, and the film-cracking problem is analyzed using both the strength and the energy criteria. The predicted crack spacing as a function of the applied strain is compared with experimental measurements of multiple cracking of SiO, films with various thicknesses on poly(ethylene terephthalate) substrates. Comparison is also made between the present and other predictions.
SDGs
Type
journal article