Relationship between wettability and interfacial reaction for Sn10Ag4Ti on Al2O3 and SiC substrates
Journal
Ceramics International
Journal Volume
24
Journal Issue
4
Pages
273-279
Date Issued
1998
Author(s)
Abstract
Sn10Ag4Ti filler metal possesses the advantage of low thermal stress for active brazing of ceramics. In order to clarify its brazing mechanism, the wettability and interfacial reactions for such an active filler metal on Al2O3 and SiC ceramics substrates were evaluated. It was shown that the contact angle of Sn10Ag4Ti on both ceramics decreased with the increase of temperature and heating time. The wettability of Sn10Ag4Ti on SiC substrate was superior to that on Al2O3 substrate. For all cases with better wettability, Ti was also found to aggregate more strongly at the brazing interface. In summarizing these results, it can be concluded that the wetting tendency of Sn10Ag4Ti on Al2O3 and SiC ceramics is decided by the interfacial reaction of Ti in the filler metal with the ceramic substrates. © 1998 Elsevier Science Limited and Techna S.r.1. All rights reserved.
Type
journal article