Integrated testing chip for pressure sensor test
Date Issued
2006
Date
2006
Author(s)
Lin, Ching-Yao
DOI
en-US
Abstract
As the pressure sensor market grows, the wafer-level sensor testing becomes more and more important. A fast and cost-effective testing method is currently needed for the present pressure sensor manufacture. Inspired by the concept of air-bearing, a new testing method based on MEMS technology is proposed in this thesis. By creating a tiny gap between the pressure sensor to be tested and the testing chip, the pressure required to stimulate the pressure sensor is caused by the viscosity of air, and the electrical output is read out by cantilever-type MEMS probe. Two kinds of cantilever-type MEMS probes used in this thesis are fabricated by different fabrication process. One is fabricated by electroplating with KMPR and SU-8 photoresists molds, and the SU-8 photoresist is used for substrate. The other is fabricated on glass substrate by electroplating with AZ P4620 and KMPR photoresist. Each type of MEMS type probes correspond to different experiment apparatuses. Based on the study in this thesis, a fast and cost effective testing method can be realized.
Subjects
壓力感測器
檢測晶片
壓力感測器檢測
SU8
pressure sensor
testing chip
pressure sensor test
Type
thesis
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