Glycolic acid in hydrogen peroxide-based slurry for enhancing copper chemical mechanical polishing

Resource

Microelectronic Engineering 77 (3-4): 193-203

Journal

Microelectronic Engineering

Journal Issue

77

Pages

193-203

Date Issued

2005

Date

2005

Author(s)

Tsai, Tzu-Hsuan

Wu, Yung-Fu

URI

Type

journal article

File(s)

Name

08.pdf

Size

514.4 KB

Format

Adobe PDF

Checksum

(MD5):4aa5eb1c5e632c9c7ca6814c1b181092