Model Extraction and Time Domain Analysis of Multi-layer Via Structure
Date Issued
2004
Date
2004
Author(s)
Sun, Ruey-Bo
DOI
en-US
Abstract
When the signal propagates through the multi-layer via environment, in the signal integrity issues, it will suffer from two composite effects, including reflection caused by via discontinuity and ground bounce excited by radial mode of parallel plate.
A new method is proposed in the thesis to demonstrate these effects in the time domain, which combines the 2-D FDTD field solver with the equivalent circuit model of via. The equivalent circuit model of via is extracted by the full wave solver HFSS, taking into account all electromagnetic effects of via in the high frequency. A 2-D FDTD solver is established to efficiently get the time domain waveform results as signal propagating through via without resorting to the time-consuming 3-D FDTD simulation.
The time domain results of the proposed method have been compared with those by 3-D FDTD method (ApsimFDTD). They both show the same effects due to via discontinuity, which validate our approach. Furthermore, extensive simulations and scaling analysis are employed to calculate the inductance and capacitance values in the equivalent circuit model of via. The charts for characterizing the equivalent circuit versus via geometry would be given, which is very useful for practical designer.
Subjects
時域分析
模型擷取
多層連通柱
等效電路
有限差分法
time domain
model extraction
via
FDTD
equivalent circuit
Type
thesis
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