The Effect of Substrate Dissolution in Brazing CP-Ti and Ti-15-3 Using Clad Ti-15Cu-15Ni Filler
Resource
ISIJ International, 50(3), 450-454
Journal
ISIJ International
Journal Volume
50
Journal Issue
3
Pages
450-454
Date Issued
2010
Date
2010
Author(s)
Abstract
The effect of substrate dissolution in brazing CP-Ti and Ti-15-3 using Ti-15Cu-15Ni filler metal has been performed in the experiment. Microstructures of infrared brazed joints are strongly related to dissolution of substrate during brazing. For the 1 800 s brazed CP-Ti specimen, the depletion of Cu and Ni from the braze alloy into substrate cause eutectoid transformation of β-Ti into lamellar Ti2Cu and α-Ti. In contrast, dissolution of Ti-15-3 substrate into the molten braze during infrared brazing results in the 1 800 s brazed zone alloyed with V, stabilizing the β-Ti to room temperature. © 2010 ISIJ.
SDGs
Type
journal article
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