In-situ Monitoring of Silicon Membrane Thickness during Wet Etching Using a SAW Sensor
Resource
Japanese Journal of Applied Physics,43(6A),3611-3617.
Journal
Japanese Journal of Applied Physics
Journal Volume
43
Journal Issue
6a
Pages
3611-3617
Date Issued
2004-06
Date
2004-06
Author(s)
Lee, C.-Y.
Cheng, Y.-C.
Wu, T.-T.
Chen, Y.-Y.
Chen, W.-J.
Pao, S.-Y.
Chang, P.-Z.
Chen, Ping-Hei
Type
journal article