Pin Grid Array Routing for MCM (II)
Date Issued
1998-07-31
Date
1998-07-31
Author(s)
DOI
872218E002033
Abstract
A special routing problem,
routing in a ball grid array package, is
first proposed in this report. Given a
chip with a number of I/O pads
distributed on its boundary and a ball
grid array package with an equivalent
number of balls, and sometimes ball
locations cannot be determined by
design. The objective is to complete
the interconnections of these I/O pads
to the corresponding external balls
with a single layer of metal wire. This
problem is called the planar routing in
a ball grid array package (PRBGA). An
efficient algorithm is proposed to solve
this PRBGA problem by using sorting
inversion table, single row routing, and
river routing techniques. Some
examples are experimental tested to
show that our routing approach is well
work on a ball grid array package.
Publisher
臺北市：國立臺灣大學電機工程學系暨研究所
Type
report
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