Publication: Formation of CuAlO<inf>2</inf> at the Cu/Al<inf>2</inf>O<inf>3</inf> interface and its influence on interface strength and thermal conductivity
| cris.lastimport.scopus | 2025-05-06T22:20:56Z | |
| cris.virtual.department | Materials Science and Engineering | en_US |
| cris.virtual.orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtualsource.department | 0629aec4-4b15-4fb8-98d8-3ee639c49979 | |
| cris.virtualsource.orcid | 0629aec4-4b15-4fb8-98d8-3ee639c49979 | |
| dc.contributor.author | Lee, S.-K. | en_US |
| dc.contributor.author | Tuan, W.-H. | en_US |
| dc.contributor.author | WEI-HSING TUAN | en_US |
| dc.creator | WEI-HSING TUAN;Tuan, W.-H.;Lee, S.-K. | |
| dc.date.accessioned | 2020-05-12T02:53:45Z | |
| dc.date.available | 2020-05-12T02:53:45Z | |
| dc.date.issued | 2013 | |
| dc.identifier.doi | 10.1111/ijac.12049 | |
| dc.identifier.scopus | 2-s2.0-84883598362 | |
| dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/492170 | |
| dc.identifier.url | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84883598362&doi=10.1111%2fijac.12049&partnerID=40&md5=b70efee5365ccb948073a5e86df21479 | |
| dc.relation.ispartof | International Journal of Applied Ceramic Technology | |
| dc.relation.journalissue | 5 | |
| dc.relation.journalvolume | 10 | |
| dc.relation.pages | 780-789 | |
| dc.title | Formation of CuAlO<inf>2</inf> at the Cu/Al<inf>2</inf>O<inf>3</inf> interface and its influence on interface strength and thermal conductivity | en_US |
| dc.type | journal article | en |
| dspace.entity.type | Publication |