Mechanical properties of intermetallic compounds on lead-free solder by moir? techniques

Resource

Journal of Electronic Materials 35 (5): 1059-1066

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

5

Pages

1059-1066

Date Issued

2006

Date

2006

Author(s)

Tsai, Iting

Wu, Enboa

Yen, S. F.

Chuang, T. H.

URI

Type

journal article

File(s)

Name

99.pdf

Size

486.3 KB

Format

Adobe PDF

Checksum

(MD5):50a02dbe6fcf8c14b18950016eb53f45