Welcome message from An-Yeu Wu, conference co-chair
Journal
IMPACT Conference 2009 International 3D IC Conference - Proceedings
Date Issued
2009
Author(s)
Abstract
Thank you for participating in IMPACT Conference 2009 and International 3D IC Conference. Due to the trend of 3D IC technology and development are discussed popularly in the world; SIPO especially holds this joint conference with IMPACT to introduce more about 3D IC technology in this conference.
SDGs
Type
other