Investigation and Analysis of the Loop Type Thermosyphon Vapor Chamber
Date Issued
2004
Date
2004
Author(s)
Chang, Hao-Han
DOI
zh-TW
Abstract
As science and technology progress, electronic products are highly powered and have higher performance and high processing speed. The thermal dissipation managements and problems of the chipset caused by high density of transistors, become an important segment of products design or research. This thesis analyses the performance of the new electronics cooling heat dissipation module – loop type thermosyphon vapor chamber (LTSVC). A LTSVC has an evaporator, a riser, a condenser, and a downcomer. When the LTSVC operates, it utilizes the phase change of working fluid in the evaporator to bring heat to the condenser via the riser. The heat is then released to environment rapidly, and vapor is condensed back into liquid. The heat transfer coefficients of boiling and condensation are so high that the system can dissipation lots of heat via low temperature gradient. The thermal resistance module is established in this research, and the influences of the heating power, the filling volume, and the type of the boiling surfaces are analysed in virtue of performance experiments. The working fluid is water. The results indicate that the system’s total resistance, evaporator resistance, and condenser resistance are decrease as the heating power increase. Thus shows that the system performs well when the heating power is high. The filling volume influences the condenser resistance. Therefore there should be a best filling volume of the system. The different boiling surfaces influence the heat transfer coefficient of the boiling. Besides the analyses of the experiment and performances, another goal is to find suitable half experience correlations for the system by using of the experiment results and according to Rohsenow’s experience correlation and Nuseelt’s module.
Subjects
平板型蒸發器
電子冷卻
蒸氣腔體
熱虹吸管
Vapor Chamber
Thermosyphon
Plate Evaporator
Electronics Cooling
Type
thesis
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