Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate

Journal

Journal of Materials Engineering and Performance

Journal Volume

11

Journal Issue

4

Pages

365-368

Date Issued

2002

Author(s)

Su, T.L.

Tsao, L.C.

Chang, S.Y.

Chuang, T.H.

TUNG-HAN CHUANG

DOI

10.1361/105994902770343872

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492029

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036692934&doi=10.1361%2f105994902770343872&partnerID=40&md5=9d671c59db07956f5032b5932315528a

Type

journal article