High electromagnetic shielding of plastic package for 2.5Gbps optical transceiver modules

Journal

IEEE Transactions on Advanced Packaging

Journal Volume

28

Journal Issue

1

Pages

89-95

Date Issued

2005-02

Author(s)

C.-W. Lin

W.-C. Hung

C.-H. Lee

W.-S. Jou

W.-H. Cheng

DOI

10.1109/tadvp.2004.841667

URI

http://scholars.lib.ntu.edu.tw/handle/123456789/317853

Type

journal article