Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer

Journal

Journal of Electronic Materials

Journal Volume

43

Journal Issue

12

Pages

4610-4618

Date Issued

2014

Author(s)

Chuang, T.H.

Lin, H.J.

Chuang, C.H.

Yeh, W.T.

Hwang, J.D.

Chu, H.S.

TUNG-HAN CHUANG

DOI

10.1007/s11664-014-3430-9

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/491975

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84925519901&doi=10.1007%2fs11664-014-3430-9&partnerID=40&md5=2bcf337e7223c836f0216e79412de550

Type

journal article