Erratum: Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu solder ball grid arrav packaaes(Journal of Electronics Materials (March 2004) 33 (171-180))
Journal
Journal of Electronic Materials
Journal Volume
33
Journal Issue
7
Date Issued
2004
Author(s)
Type
other