Study on Taper Angle Reduction of the Microelectrode Fabricated by Electrochemical Machining
Date Issued
2009
Date
2009
Author(s)
Liu, Yen-Chen
Abstract
Wire Electro-Discharge Grinding (WEDG) process is commonly used to fabricate the microelectrodes. Generally, it would take more than 25 minutes to fabricate a 2mm length microelectrode from the diameter of 300μm to 100μm. So the low material removal rate and the time consuming of the WEDG process are the problems to overcome. Moreover, by the Micro-ECM (Micro Electrochemical Machining) process, though the high material removal rate, bright surface finish, no stress or burrs, no tool wear and ability to improve the efficiency of microelectrode could be obtained, the fabricated microelectrode would have a taper angle and a needle tip. It would cause a serious tapering problem when this electrode is used to fabricate the hole by micro-EDM drilling. Thus, this study is focused on the developing a method of fabricating a micro tungsten carbide electrode by Micro-ECM with an insulated blind hole which is made of PMMA material in the end of the electrode to reduce the taper angle. Experimental results show that a 3mm length tungsten carbide rod was fabricated from the diameter of 300μm to 50μm with no tapering, and the consuming time is less than 5 min. Another method of flushing Micro-ECM process was also proposed. During the flushing Micro-ECM process, under the condition of the inter-electrode gap less than 50μm, a 2mm length microelectrode could be fabricated from the diameter of 300μm to 80μm. The consuming time could even be controlled within 2 min. In conclusion, fabricating the microelectrode with the developed method, the taper angle could be reduced and also apparently improve the efficiency.
Subjects
Wire Electro-Discharge Grinding (WEDG)
Micro Electrochemical Machining(Micro-ECM)
Tungsten carbide
Machining time
Type
thesis
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