Effects of la addition on microstructure and mechanical properties of SN-58BI solders joints with osp pads

Journal

Canadian Metallurgical Quarterly

Journal Volume

52

Journal Issue

3

Pages

285-294

Date Issued

2013

Author(s)

Shiue, Y.Y.

Chuang, T.H.

TUNG-HAN CHUANG

DOI

10.1179/1879139513Y.0000000075

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/491978

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84883577222&doi=10.1179%2f1879139513Y.0000000075&partnerID=40&md5=5285aae6852b53759d2e7f35543c87a5

Type

journal article