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  4. How the common retention acceleration method of 3D NAND flash memory goes wrong?
 
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How the common retention acceleration method of 3D NAND flash memory goes wrong?

Journal
HotStorage 2021 - Proceedings of the 13th ACM Workshop on Hot Topics in Storage and File Systems
Pages
71-76
Date Issued
2021
Author(s)
Li Q
Ye M
Xue C.J
Li Q
Ye M
Xue C.J.
TEI-WEI KUO  
DOI
10.1145/3465332.3470877
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85112080226&doi=10.1145%2f3465332.3470877&partnerID=40&md5=c4f348054c8860ee79d4db46b56b8e43
https://scholars.lib.ntu.edu.tw/handle/123456789/607470
Abstract
The reliability of solid-state drives (SSDs) has become increasingly important as SSDs are now widely applied in data centers. Retention error is a major source of impact on the reliability of SSDs. Even though the common practice in understanding the retention errors of an SSD is done by high-temperature baking processes, their characterization accuracy is not yet rigidly reviewed. In this paper, we first present how the common retention acceleration method goes wrong. Through a one-year study of 3D flash error behaviors, we found that the retention errors through baking with high temperatures have very different characteristics from the real long-retention errors. These differences come from the inherent structure and the materials of 3D NAND flash. Several findings regarding the retention errors characterized through baking are presented, followed by the analysis of the error behaviors. Finally, the retention errors of one year on 3D flash memory are provided with real data. ? 2021 Association for Computing Machinery.
Subjects
3D NAND flash
High temperature
Retention errors
Bakeries
Errors
File organization
Memory architecture
NAND circuits
3-d nand flash memory
Acceleration method
Baking process
Data centers
NAND Flash
Solid state drives
Flash memory
Type
conference paper

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