先進微電子封裝中錫銀銅銲料與金/鎳表面處理層之界面反應

Resource

Journal of the Chinese Colloid & Interface Science,26(2),99-107.

Journal

Journal of the Chinese Colloid & Interface Science

Journal Volume

26

Journal Issue

2

Pages

99-107

Date Issued

2004-02

Date

2004-02

Author(s)

蕭麗娟

何政恩

URI

http://ntur.lib.ntu.edu.tw//handle/246246/198805

Type

journal article