Mechanical properties of intermetallic compounds on lead-free solder by moiré techniques

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

5

Pages

1059-1066

Date Issued

2006

Author(s)

Tsai, I.

Wu, E.

Yen, S.F.

TUNG-HAN CHUANG

DOI

10.1007/BF02692567

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492015

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-33745011894&doi=10.1007%2fBF02692567&partnerID=40&md5=510fbb8c2c11582ea06539fa6ca37a1c

Type

conference paper