Damping characteristics of Sn-3Ag-0.5Cu and Sn-37Pb solders studied by dynamic mechanical analysis
Journal
Scripta Materialia
Journal Volume
63
Journal Issue
10
Pages
957-960
Date Issued
2010
Author(s)
Abstract
Sn-37Pb solder and pure Sn metal exhibit a conspicuous high-temperature damping background (HTDB) in low-frequency internal friction Q-1(T) curves with activation energies, H, of HTDB being 0.43 and 0.98 eV, respectively. Sn-37Pb solder has a lamellar eutectic structure that can promote the diffusion-assisted climb of dislocations, resulting in lower H. Sn-3Ag-0.5Cu solder shows no HTDB in Q-1(T) curves since the formation of Cu6Sn5 and Ag 3Sn intermetallics in the eutectic network band can impede dislocation motion. © 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Type
journal article