SUS301不銹鋼微薄板U形彎曲研究
Journal
鍛造
Journal Volume
19
Journal Issue
2
Start Page
10
End Page
16
ISSN
1023-750X
Date Issued
2010-06
Author(s)
杜國印
Abstract
本研究將針對廣泛應用於電子通訊零組件之不同厚度不銹鋼（Stainlesssteel）301材料，進行薄板微彎曲成形之研究。由於材料尺寸微小化後，其材料性質會隨尺寸效應（Size effect）而有所改變，因此傳統巨觀尺寸彎曲變形的研究模式不一定適用於精微彎曲（Micro-bending）之分析，本文先規劃針對不銹鋼材料微小化後之尺寸效應進行拉伸實驗及彎曲實驗分析，以取得精微尺寸之材料性質及彎曲回彈特性。至於材料之塑性變形則以CAE分析技術來觀察材料於厚度方向的應力分佈，並藉此來預估回彈後的角度，並與實驗作一比對驗證。本文亦針對各材料與製程參數，包括：材料尺寸、晶粒尺寸大小（Grain size）與彎曲R角對回彈現象之影響進行探討。藉由上述的研究，將可提升精微薄板彎曲成形技術，將沖壓元件薄型化，以掌握精微沖壓成形的關鍵技術。
The material investigated into micro-bending is 301 stainless steel sheet with different thicknesses that was extensively applied to electron communication components. With the miniaturization of sheet metal forming working process, the material properties will be different, and so-called size effects. Even though macro-bending is well understood and has been extensively studied, the concepts of macro-bending cannot be directly applied to the micro-bending, and therefore the important papers in connection with traditional bending forming and micro-bending must be collected and integrated. In order to obtain the material properties of miniaturization sheet, tensile and bending experiments are planned to analysis size effect on miniaturized 301 stainless steel sheet. By CAE analysis, the stress distribution along the direction of sheet thickness during deformation process of sheet would be observed and the springback angle after deformed sheet would be estimated. The effects between the springback behavior of micro sheet metal and process parameters which include specimen size, grain size and bending radii would be studied. According to the previous research, the technique of micro-bending forming could be improved and promoted.
Subjects
不銹鋼
精微彎曲
尺寸效應
回彈
晶粒尺寸大小
製程參數
CAE分析
實驗驗證
微硬度實驗
Stainless Steel
Micro-Bending
Size Effect
Springback
Grain Size
CAE Analysis
Type
journal article