How to improve chip strength to avoid die cracking in a package

Resource

Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on

Journal

Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on

Pages

-

Date Issued

2004-06

Date

2004-06

Author(s)

Chen, Shoulung

Shih, I.G.

Chen, Y.N.

Tsai, C.Z.

Lin, J.W.

Wu, Enboa

DOI

DOI

N/A

URI

Type

other

File(s)

Name

01318292.pdf

Size

510.57 KB

Format

Adobe PDF

Checksum

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