Morphology and Growth Kinetics of Intermetallics Formed during the Interfacial Reactions of Solder Joints
Resource
J. Chin. Colloid and Interface Soc. 26: 69-79
Journal
J. Chin. Colloid and Interface Soc. 26:
Pages
69-79
Date Issued
2004
Date
2004
Author(s)
Chuang, T.H.
Wu, H.F.
Huang, K.W.
Yen, S.F.
Lin, H.J.
Type
journal article