The effect of 0.5 wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads

Resource

Materials Letters, 64(4), 506-509

Journal

Materials Letters

Journal Volume

64

Journal Issue

4

Pages

506-509

Date Issued

2010

Date

2010

Author(s)

Lin, Hsiu-Jen

DOI

URI

Type

journal article

File(s)

Name

368.pdf

Size

23.45 KB

Format

Adobe PDF

Checksum

(MD5):a95f2b96517a023712cb45e2d017546e