Thermal Analysis and Structural Optimum Design of PCB Bonding Modules
Date Issued
2010
Date
2010
Author(s)
Lee, Chung-Yun
Abstract
This paper investigates the thermal behaviors of PCB bonding modules for TFT-LCD panel under non-uniform temperature distribution caused by the heating process. Firstly, solid models of the PCB bonding modules are generated by commercial CAD software and then imported into commercial finite element analysis software for producing finite element meshes. The non-uniform temperature distribution and its thermal deformation in the heating process are analyzed. The results show that the PCB bonding modules would have the thermal deformation because of materials with different coefficients of thermal expansion. Next, this paper proposes a thermal compensated mechanism for the PCB bonding modules. When the SKD61 material is chosen as the bonding head, SUS303 as the parallel head, and Aluminum 6061-T6 as the clipping parts, the thermal deformation would be decreased effectively. Also, this paper adjusts the gap between parallel head and bonding head to decrease the thermal deformation. With a properly chosen gap value, the surface of the PCB bonding modules would be kept on a flat condition. Finally, an integrated optimum design program will be applied to search the best structural design for the PCB bonding modules with heating powers of the six specific locations chosen as design variables. The optimum design result shows that the PCB bonding modules with special designed heaters has more uniformly temperature distribution.
Subjects
PCB bonding module
finite element analysis
thermal analysis
thermal compensated mechanism
structural optimum design
Type
thesis
File(s)![Thumbnail Image]()
Loading...
Name
ntu-99-R96522603-1.pdf
Size
23.53 KB
Format
Adobe PDF
Checksum
(MD5):6d476e6d295bb6c0b176c87842993497