Effects of Isothermal Heat Treatment on Microstructure Evolution of Microfluidic Electroless Ni-P Interconnection Structure
Journal
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Journal Volume
2020-October
Pages
172-176
Date Issued
2020
Author(s)
Abstract
Microfluidic electroless interconnection (MELI) process using electroless Ni-P plating has strong advantages over thermocompression bonding (TCB) in low temperature and pressureless bonding [1,2]. However, in a typical electronic assembly process, chips can be exposed to high temperatures through subsequent manufacturing processes and service conditions. A P-rich layer (6-8 wt.%) was observed at the bonding interface of Ni-P joints in the previous research [2]. The present study aims to investigate the effects of aging treatment on Ni-P joints in terms of the formation of voids and intermetallic compounds, the changes in microstructures, and the P distribution. Three different aging temperatures, which are 150 °C, 300 °C, and 400 °C, were chosen. The results show that aging at 150 °C for 1000 h and 300 °C for 1 h have no substantial effect on Ni-P interconnections. As for the Ni-P joints thermal aging at 400 °C for 1 h, the amorphous phases were transformed into a crystalline structure consisting of Ni and Ni3P phases, increasing the homogeneity of P in the deposit. ? 2020 IEEE.
Subjects
Electronics industry; Heat treatment; Integrated circuit interconnects; Microfluidics; Microstructure; Microsystems; Nanocrystalline materials; Temperature; Thermal aging; Crystalline structure; Electroless ni-p plating; Electronic assemblies; Interconnection structure; Isothermal heat treatments; Manufacturing process; Micro-structure evolutions; Thermo compression bonding; Modified atmosphere packaging
Type
conference paper