Design of shorting vias in alternative PCB planes for suppressing ground-bounce induced electromagnetic emission
Journal
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09
Pages
247-250
Date Issued
2009-10
Author(s)
Abstract
The stacked ground planes with vias stitching is employed to suppress the ground-bounce induced electromagnetic emission in multilayer printed circuit boards. This paper developed an analytic normal-mode analysis and used it to design the optimized positions of the vias in the board periphery. Comparison with full-wave simulation validates that the proposed systematic design procedure can easily achieve the desired EMI suppression from DC up to several GHz.
Type
conference paper