Formation and growth of intermetallics in an annealing-twinned Ag-8Au-3Pd wire bonding package during reliability tests

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Journal Volume

3

Journal Issue

1

Pages

3-9

Date Issued

2013

Author(s)

Chuang, T.-H.

Chang, C.-C.

Chuang, C.-H.

Lee, J.-D.

Tsai, H.-H.

TUNG-HAN CHUANG

DOI

10.1109/TCPMT.2012.2221090

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/491982

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84872268084&doi=10.1109%2fTCPMT.2012.2221090&partnerID=40&md5=198bc36e6f1a14d8e13164e770f303a8

Type

journal article