Solid Liquid Interdiffusion Bonding of Zn4Sb3 Thermoelectric Material with Cu Electrode

Journal

Journal of Electronic Materials

Journal Volume

45

Journal Issue

10

Pages

4935-4942

Date Issued

2016

Author(s)

Lin, Y.C.

Lee, K.T.

Hwang, J.D.

Chu, H.S.

Hsu, C.C.

Chen, S.C.

Chuang, T.H.

TUNG-HAN CHUANG

DOI

10.1007/s11664-016-4645-8

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/491961

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84984600749&doi=10.1007%2fs11664-016-4645-8&partnerID=40&md5=34bd062614f11a746a72022d7084e4a3

Type

journal article