Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finish

Journal

Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an

Journal Volume

32

Journal Issue

2

Pages

229-234

Date Issued

2009

Author(s)

Jain, C.-C.

Wang, S.-S.

Wu, H.-M.

Chuang, T.-H.

DOI

URI

URL

Type

journal article