Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder joints

Resource

Journal of Alloys and Compounds, 500(2), 167-174

Journal

Journal of Alloys and Compounds

Journal Volume

500

Journal Issue

2

Pages

167-174

Date Issued

2010

Date

2010

Author(s)

Lin, Hsiu-Jen

DOI

URI

Type

journal article

File(s)

Name

317.pdf

Size

23.45 KB

Format

Adobe PDF

Checksum

(MD5):b632caaa7640ce94e937195ec2d74654