In-situ SEM Investigation of Tensile Deformation of Various Sn-xBi Solder Alloys
Part Of
2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS 2026
Start Page
195
End Page
196
ISBN (of the container)
9784991483516
ISBN
9784991483516
Date Issued
2026
Author(s)
Abstract
The electronic packaging industry has emphasized the importance of usage of lead-free low temperature solders nowadays in order to decrease the occurrence of thermal warpage, and Sn-Bi alloys have become potential candidates. Though myriads of properties have been discovered, the in-situ fracture characteristics lack understanding. Thus, in this study, in-situ tensile deformation of 70Sn30Bi and 50Sn50Bi were observed thoroughly. Crack propagation in two alloys both demonstrated intergranular behaviors, while proportions of fracture between Sn grain boundaries, Bi grain boundaries and phase boundaries between Sn and Bi grains varied.
Event(s)
25th International Conference on Electronics Packaging, held in conjunction with the IEEE EPS Hybrid Bonding Symposium, ICEP-HBS2026, 14 April 2026 - 18 April 2026, Hiroshima
Subjects
Crack propagation
In-situ observation
Sn-Bi alloy
Tensile deformation
Publisher
Institute of Electrical and Electronics Engineers Inc.
Type
conference paper