A mathematical method for VLSI thermal simulation at the system and circuit levels

Journal

Recent Topics on Modeling of Semiconductor Processes, Devices, and Circuits

Pages

149-166

Date Issued

2011

Author(s)

Oh, D.

Chen, C.C.P.

Hu, Y.H.

CHUNG-PING CHEN

DOI

10.2174/97816080507411110101149

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/501083

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84882644550&doi=10.2174%2f97816080507411110101149&partnerID=40&md5=ce48b16ae2a0ce5a0f0365c7cc2457f2

Type

book part