Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding

Resource

Microelectronics Reliability, 51(1), 125-129

Journal

Microelectronics Reliability

Journal Volume

51

Journal Issue

1

Pages

125-129

Date Issued

2011

Date

2011

Author(s)

Lai, Yi-Shao

Wang, Yi-Wun

DOI

URI

Type

journal article

File(s)

Name

252.pdf

Size

23.45 KB

Format

Adobe PDF

Checksum

(MD5):1dc7d0f97491e8c385101aed9f335856