SI-aware vias and contact pads layouts and L-R equalization technique for 12Gb/s backplane serial I/O interconnections
Journal
IEEE Transactions on Electromagnetic Compatibility
Journal Volume
55
Journal Issue
6
Pages
1284-1292
Date Issued
2013-12
Author(s)
Abstract
With increasing demand on higher performance for high-speed blade servers, the signal integrity aware (SI-aware) layouts and equalization have been attributed as the critical techniques to improve the electrical performance. This paper describes the SI-aware layouts of patterned ground and capsule-shaped antipad to enhance the connector performance. Besides, a new differential equalizer by taking advantage of differential via-stubs is proposed to restore the deteriorated eye diagram. Their application of a 117.5-cm SATA-II links demonstrates significant improvement in eye height and timing jitter. Furthermore, a viable approach is suggested to successfully reopen the eyes when the data rate increases from the current 3 to 12 Gb/s. The measurement results are also provided to validate the proposed design concepts.
SDGs
Type
journal article