Research and Development on the Manufacturing Process of Diamond Conditioner for Die-Sinking EDM
Date Issued
2008
Date
2008
Author(s)
Chiang, Jui-Hsuan
Abstract
Semiconductor chip develops toward smaller volume, high density circuit, and low power consumption in recently years. CMP is broadly applied to planarization process in large surface. During CMP process, polishing pad lose it function with time, therefore, diamond conditioner need to be dressed in order to scrape glazed pad and regenerate new asperities on pad. Diamond conditioner is composed of artificial diamond brazed on substrate and arranged in matrices. his article shows a new mass production manufacturing process for diamond conditioner. Using experiment to realize whether die-sinking electric discharge machining can make pyramid structure on PCD surface or not. This article is composed of three parts: (1) Designing and manufacturing electrode. According to property of copper electrode which is suit for smaller current in EDM made by WEDM. (2) Searching for electric discharge parameters. According to voltage and current waveform observed by oscilloscope, not only try to find parameters which waveform is almost normal but also get lower electrode consumption and less machining. (3) Machining procedures of micro pyramid on PCD are divided into six parts and made it by EDM. Micro pyramid on PCD are successfully made by this manufacturing process which is shown in this article, the smallest difference of tip height is about 7μm in a row, others are less than 20μm.
Subjects
electric discharge machining
chemical mechanical polishing
diamond conditioner
diamond dresser
polycrystalline diamond
Type
thesis
File(s)![Thumbnail Image]()
Loading...
Name
ntu-97-R94522715-1.pdf
Size
23.53 KB
Format
Adobe PDF
Checksum
(MD5):ee7d8b9712bcd8554288da8cdaef5725