A novel noise mitigation design for TSV-to-device coupling using power distribution network
Journal
IEEE 23rd Topical Meeting on Electrical Performance of Electronic Packaging and Systems
Pages
57-60
Date Issued
2014-10
Author(s)
Abstract
The TSV-induced substrate noise has become an important issue in 3D-IC. When signals passes through TSV, noise will couple through silicon substrate and cause serious body voltage fluctuation. This paper proposes using carefully designed power distribution network (PDN) to reduce the coupling coefficient from TSV to surrounding devices. The impact of metal placement and its coverage percentage on noise isolation is evaluated. By utilizing the PDN, the keep-out zone for active devices can be reduced significantly.
SDGs
Type
conference paper