Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits
Journal
Applied Physics Letters
Journal Volume
88
Journal Issue
1
Date Issued
2006
Author(s)
Abstract
A simple mechanical model for a deposited film∕substrate couple is presented to describe how film deposition at an elevated temperature induces change in the substrate’s in-plane dimensions at room temperature. The model provides a quantitative guideline for reducing, or completely eliminating, this elongation, by tailoring the tensile built-in stress in the deposited film. The dimensional stability so achieved is necessary for accurate overlay alignment of photomasks during the fabrication of thin-film electronic circuits.
Type
journal article