Improving the sidewall quality of nanosecond laser-drilled deep through-silicon vias by incorporating a wet chemical etching process

Journal

Micro & Nano Letters

Date Issued

2012

Author(s)

Chao-Wei Tang

Kuan-Ming Li

Hong-Tsu Young

URI

http://jjap.jsap.jp/link?JJAP/51/06FL03/

https://scholars.lib.ntu.edu.tw/handle/123456789/587662

Type

journal article