金屬微形元件之等溫凝固微熱壓成型研究(I)
Date Issued
2004
Date
2004
Author(s)
DOI
922216E002032
Abstract
“The Isothermal Hot Embossing
Process” under consideration in this
project entails the blending of a
high-melting-point metallic powder
(Ni、Cu or Ag) with a eutectic alloy
(Ga24.6In or Ga13.7Sn) which exists in
liquid state at room
temperature ,whereas the mixtures in
paste at room temperature will be heated
and partially molten in a hot embossing
mould at a temperature below 350℃.
The partially liquid mixtures
subsequently spur on the isothermal
solidification reaction at the same
temperature (reaction time:30sec to
30min, or longer if necessary). Solid
intermetallic compounds are expected
to form after such interfacial reactions,
which will substitute the previous liquid
or low-melting-point components. The
resultant metallic micro-devices will be
found to possess a single-phase
microstructure consisting of purely
monolithic intermetallics, or to form a
composite phase of high-melting-point
metallic powder held in place by the
surrounding intermetallic matrix. During
the first year of this project, the
solid-liquid interdiffusion and
isothermal solidification reaction
occurred at the interfaces of various
metallic mixtures will be systematically
investigated. Chemical compositions
and growth kinetics of the resulting
intermetallic compounds will also be
analyzed. Furthermore, a tryout-stage
verification of the applicability of the
2 proposed innovative process will be
initiated.
Subjects
MEMS
hot embossing
isothermal solidification
solid-liquid interdiffusion
metallic micro-devices
Publisher
臺北市：國立臺灣大學材料科學與工程學研究所
Type
report
File(s)![Thumbnail Image]()
Loading...
Name
922216E002032.pdf
Size
371.17 KB
Format
Adobe PDF
Checksum
(MD5):2bcd397ebae408c0664595325cb5080f