Design and High-G Shock test Simulation of Thin-Film Au Igniter
Date Issued
2010
Date
2010
Author(s)
CHENG, Hsiang-Lien
Abstract
To prevent the components from malfunctions due to impacts in the working environment, all the electronic and electro-explosive devices are demanded to pass impact simulation tests. Owing to technological progresses, traditional electrical igniters have been replaced by ignition-chips. To assemble the whole ignition system, ignition-chips are overlaid on the igniter heads and packaged in the compartment cases. This innovative design is to integrate the ignition circuit by directly coating an Au thin film bridge on the igniter head with vacuum evaporation technique to fabricate the ignition device.
Prior to manufacturing, impact tests are usually carried out to validate if this Au thin film bridge can sustain impacts in the working conditions.
In this thesis, transient response of the innovative igniter head subject to high-G impact is simulated according to MIL-STD 883E specifications.
The simulation results evidence that the igniter head could survive under 120,000 G extremely high impacts. Although the safety factor of the glass part is only slightly larger than 1, it which is still below the common CAE requirement of 1.5. In this thesis, placing a ceramics spacer beneath the filling glass can successfully improve the safety factor of the glass part to over 1.5 that which would effectively enhance the anti-impact capability.
Subjects
High-G impact
metal igniting film
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