A study of copper chemical mechanical polishing in urea–hydrogen peroxide slurry by electrochemical impedance spectroscopy

Resource

Applied Surface Science 214 (1-4): 120-135

Journal

Applied Surface Science

Journal Issue

214

Pages

120-135

Date Issued

2003

Date

2003

Author(s)

Tsai, Tzu-Hsuan

Wu, Yung-Fu

URI

Type

journal article

File(s)

Name

06.pdf

Size

439.29 KB

Format

Adobe PDF

Checksum

(MD5):34539169c383535143fd72d5d95b1eca