High-Thermal-Conductivity Dummy Die and Finned Lid for Enhanced Liquid Cooling of 2.5D ICs
Part Of
Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024
Start Page
1162
End Page
1165
ISBN (of the container)
979-833152200-1
ISBN
[9798331522001]
Date Issued
2024-12-03
Author(s)
DOI
10.1109/EPTC62800.2024.10909810
Event(s)
26th Electronics Packaging Technology Conference, EPTC 2024
SDGs
Publisher
IEEE
Type
conference paper