High-Thermal-Conductivity Dummy Die and Finned Lid for Enhanced Liquid Cooling of 2.5D ICs
Part Of
Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024
Start Page
1162
End Page
1165
ISBN (of the container)
979-833152200-1
ISBN
[9798331522001]
Date Issued
2024-12-03
Author(s)
DOI
10.1109/EPTC62800.2024.10909810
Abstract
2.5D ICs have evolved to become the standard package platform for the integration of ever-more high-power GPUsand high-bandwidth-memory stacks (HBMs), and a key enabler of the rapid performance advancement we are witnessing today for applications such as high-performance computing (HPC), data centers, and artificial intelligence (AI). Today, direct-to-chip liquid cooling involving an integrated heat spreader and a cold plate on the GPU backside has been successfully deployed to cool high-power GPUs with a chip power as high as 1200 W. Moving forward, it is highly desirable to extend the operating range of a 2.5D IC to be able to handle a GPU power beyond 1200 W/chip without exceeding a maximum operating temperature of 100°C to maintain high performance. In this work, it was demonstrated that with the incorporation of a large high-thermal-conductivity (HTC) dummy die and a large finned Cu lid to enlarge the effective cooling area without causing mechanical integrity issues, the maximum allowable GPU power in a thermally enhanced 2.5D package structure can be increased to 1700 W, while keeping other conditions identical.
Event(s)
26th Electronics Packaging Technology Conference, EPTC 2024
SDGs
Publisher
IEEE
Type
conference paper