A 3-D Pillar-Based Electromagnetic Interference Shield for W-Band Antenna on Silicon Using Wire Bonding Technology
Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology
Journal Volume
11
Journal Issue
12
Date Issued
2021-12-01
Author(s)
Abstract
This letter presents a 3-D electromagnetic interference (EMI) shield fabricated by a commercially available wire bonding technology to reduce EMI between a W -band (94 GHz) integrated-passive-device (IPD) antenna and other function blocks in a package. This EMI shield consists of vertical pillars fabricated by cutting out the wires created from the gold (Au) stud bumps, which are bonded on the nickel/gold (Ni/Au) pads surrounding the IPD antenna that adopts a cavity-backed slot structure. The heights of these wire pillars are made around 500~mu text{m} for being higher than that of a normal CMOS chip. The measured isolation ( -S21 ) from the transmitter (TX) IPD antenna to the receiver (RX) IPD antenna, each equipped with this EMI shield, demonstrates the EMI shielding functionality at 93.1-95.5 GHz and maximum shielding effectiveness (SE) of 16.92 dB at 94.2 GHz.
Subjects
3-D | antenna on silicon | antenna-in-package (AiP) | cavity-backed slot antenna | electromagnetic interference (EMI) | integrated passive device (IPD) | millimeter-wave (mm-Wave) | pillar | shielding | vertical interconnection | W-band | wafer level packaging (WLP) | wire bonding
SDGs
Type
journal article