Interfacial reactions between ni substrate and the component bi in solders

Journal

Journal of Electronic Materials

Journal Volume

28

Journal Issue

1

Pages

57-62

Date Issued

1999

Author(s)

Lee M.S.

Liu C.M.

DOI

10.1007/s11664-999-0195-7

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0032785803&doi=10.1007%2fs11664-999-0195-7&partnerID=40&md5=c3157362b642de5d0fe0c082c7a37618

https://scholars.lib.ntu.edu.tw/handle/123456789/432750

Publisher

Minerals, Metals and Materials Society

Type

journal article