The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering

Resource

Journal of Alloys and Compounds, 492(1-2), 99-104

Journal

Journal of Alloys and Compounds

Pages

99-104

Date Issued

2010

Date

2010

Author(s)

Lin, Y.W.

Wang, Y.W.

DOI

URI

Type

journal article

File(s)

Name

359.pdf

Size

23.45 KB

Format

Adobe PDF

Checksum

(MD5):ce986230984df26e0dbfa992e95647e3