Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage design
Journal
2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
Pages
232-235
Date Issued
2012
Author(s)
Chang, Y.-J.
Chuang, H.-H.
Lu, Y.-C.
Chiou, Y.-P.
Wu, T.-L.
Chen, P.-S.
Wu, S.-H.
Kuo, T.-Y.
Zhan, C.-J.
Lo, W.-C.
Type
conference paper