Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates

Resource

Journal of Electronic Materials 33 (1): 22-27

Journal

Journal of Electronic Materials

Journal Volume

33

Journal Issue

1

Pages

22-27

Date Issued

2004

Date

2004

Author(s)

Chuang, T. H.

Wu, H. M.

Cheng, M. D.

Chang, S. Y.

Yen, S. F.

URI

Type

journal article

File(s)

Name

86.pdf

Size

229.65 KB

Format

Adobe PDF

Checksum

(MD5):5e56aade65b0c96bd7481ade0ce9c380